Samsung to invest 850 million USD to produce FC-BGA in Vietnam
(VOVWORLD) - Electronics giant Samsung of the Republic of Korea’s will invest 850 million USD in its Vietnamese subsidiary to build flip chip-ball grid array (FC-BGA) production facilities and infrastructure.
 The logo of Samsung Electronics is seen at its office building in Seoul, South Korea. (Photo: VNA) |
The investment, which will be executed in stages until 2023, is intended to actively respond to growing demand for package substrates due to the development of more powerful semiconductors and market growth. It is also designed to help expand the company's presence in high value-added product markets in the long term.
Samsung plans to strengthen its capabilities to respond to customers’ demand by dedicating the Vietnamese corporation to production of FC-BGA, while making its Suwon and Busan plants in Korea focus on technology development and high-end products.
FC-BGA is a highly-integrated package board used to connect a high-integration semiconductor chip to a main board.